FAE Support and Substance Engineering for
Wireless Connectivity Chipsets

Client Overview

A semiconductor giant offering a wide range of application processors and MCUs with secure connectivity for industries like automotive, industrial IoT, mobile, and communication infrastructure markets.

Business Challenge

After acquiring wireless business of another semiconductor company, the client not only added wireless products portfolio but also a large customer base. Most of them being tier 1 and 2 customers working on cutting edge products with shorter launch timelines, client wanted to expand their team with experienced resources to provide extended support for any needs of end-customers and resolve issues in timely manner. Also, it was a challenge to support customer’s end applications where client’s chipset is integrated with third party processors and RTOS.

To address this nice to have situation, client was looking for a partner cum system integrator having hands-on multiple technologies and processors who can work with their internal development team to resolve issues, provide FAE support to their customers enabling error free end applications, while developers can work on new features development.

VOLANSYS Contribution

VOLANSYS is working as extended team of client’s FAE group to provide support to tier-1 and tier-2end- customers.

  • Pre-sales and post-sales technical support for client’s wireless connectivity platforms (88Wxx series SoCs and 88MWxx MCUs)
    • Owned and resolved WLAN and BT/BLE technical support tickets for various connectivity chipsets (88Wxx series)
    • Worked closely with end customers, their partners, and internal team for:
      • Issue classification and resolution
      • Hot-fixed releases for quicker issue resolution
      • System logs analysis to identify root cause across components and chipsets and work with internal R&D team for issue debugging to
        resolution to delivering a fix to customer
      • Live debugging sessions with customer for faster resolution
      • Supported integration-related technical issues for WLAN and BT/BLE
      • Validation of end-customer releases
  • Enhanced wireless connectivity chipsets
    • Bring-up and integration of wireless chipsets on client’s host platform (MX RT, i.MX 8 series) running on FreeRTOS, Yocto Linux and
      Android – version 8 and above
    • Created, enhanced and reviewed technical documentation (Application Notes, User Guides, etc…) that can be used by client’s support team
    • Developed specific use case/ demo to showcase Wi-Fi and BT/BLE capabilities
  • Performance measurement and competitive analysis
Technologies | Engineering Expertise

WLAN | Wi-Fi I BT/ BLE | FreeRTOS | Yocto Linux | Android | Customer Technical Support | Embedded Engineering

Solution Architecture

FAE Support and Substance Engineering DiagramCustomer Support – Ticket Workflow

Benefits Delivered
  • Extended customer technical support enabled client to keep the end-customers satisfied with flawless and expedited production increasing their chipset sales volume
  • Reduced inflow of issues to client’s development team enabling them to focus on new development
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